The Guangdong International Packaging Printing and Label Summit Forum & the 19th Packaging Printing and Label Annual Conference 2023 was held on April 10 in Dongguan. Hosted by the China Packaging Federation, the conference saw the participation of Shanghai Techsun. The annual conference brought together nearly 700 industry representatives from anti-counterfeiting traceability, packaging printing enterprises, and end-user brands.
The conference reviewed the overall operation of China’s packaging industry in 2022, with a special focus on interpreting a series of policies issued by the government and relevant authorities. Green packaging, smart packaging, and safe packaging were identified as the “three major directions” for the industry. The event also provided a comprehensive analysis of the current state and future trends of the packaging and product anti-counterfeiting traceability market, showcased new anti-counterfeiting materials, technologies, products, and processes in the packaging industry, and built a professional communication platform for participating enterprises.
（Ms. Xu LinYihui, Chief Executive Officer）
Ms. Xu LinYihui, Chief Executive Officer of Techsun, was invited to attend and deliver a keynote speech. During the session on industrial development, Xu shared three insights based on this year’s Government Work Report from the “Two Sessions”: first, promoting the healthy development of private enterprises; second, advancing industries toward the mid-to-high end; third, accelerating the construction of a modern industrial system. She also officially announced the date, venue, theme, and other details of the 6th Anti-Counterfeiting Traceability Supply-Demand Forum in 2023, and sincerely invited all leaders and fellow entrepreneurs present to visit Techsun for exchanges and collaboration.
（Ms. Liu Chunyan, Senior R&D Director）
Ms. Liu Chunyan, Senior R&D Director of Techsun’s Information Technology Center, delivered a special report at the annual conference on the innovative application of RFID technology in anti-counterfeiting traceability. She introduced Techsun’s outstanding experience in the anti-counterfeiting traceability field, shared the company’s technological achievements in anti-counterfeiting traceability and specialty packaging materials, and analyzed typical application cases such as Kweichow Moutai and Lidu.
Looking ahead, Techsun will, as always, join hands with industry partners to carry out multi-faceted and multi-level exchanges and cooperation, striving to incubate more achievements in the fields of anti-counterfeiting traceability and packaging, and make greater contributions to the anti-counterfeiting and packaging industry.
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